Laser Machines and Systems
WaferLase II
Perform high-speed silicon wafer etching, marking, and glass scribing for NGS Flow Cell production with automated tools that deliver high precision with minimal heat damage.
WaferLase systems combine robotic part handling, automated part alignment, a laser source, beam delivery optics, and control and interface software. System components are mounted on a granite base within a welded steel frame for maximum stability.
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Semiconductor Wafer Marking and Glass Scribing
Select the laser source, part transport, and other automation options to configure a WaferLase processing system that is right for your application and budget.
Product Specifications
Parameter |
Details |
Dimensions (L x W x H) |
2560 mm x 2315 mm x 2084 mm |
Laser Source |
Ultrashort Pulse Laser |
Axis Travel X/Y/Z |
450 mm x 450 mm x 150 mm |
Axis Speed |
up to 1000 mm/sec |
Featured Blog
WaferLase II Streamlines NGS Flow Cell Production
The new Coherent WaferLase II automated glass cutting systems combines automation with the proprietary SmartCleave technology for an environmentally friendly, low-cost production solution for Next Generation Sequencing (NGS) Flow Cells.
